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S-5: BUILT FOR NEXT-
GEN GPU RACKS

Built for the widest high-density server requirements, including OCP racks and NVL-class systems. S-5 combines integrated liquid-to-chip pathways with high-density air-side cooling for confident deployments at any density.

S-5 extends the S-Series architecture with a 42-inch wide, deeper cabinet for next-generation GPUs. With optional internal power pass-through and Dynamic Density Control™, S-5 delivers operational clarity and real-time thermal optimization for AI/HPC clusters.

Key Features

Dynamic Density Control™ for real-time airflow and temperature optimization

42-inch wide and deeper cabinet for OCP racks and NVL-class Rubin systems

Optional internal power pass-through to delineate site owner/operator responsibilities

Integrated liquid-to-chip cooling paths for extreme rack densities

Telemetry-ready; integrates with DDC monitoring and DCIM

High-density air-side cooling paired with containment for stability

Modular design for fast roll-in and scalable deployment

PRODUCT HIGHLIGHTS

S-5 Model Specs

Model S-5 GPU S-5 Max
Heat Abatement 50-85kW air-only cooling 85-100kW air-only cooling
Rack Width 42" wide 42" wide
Rack Units 48U Roll-in only 48U Roll-in only

Specifications

Width/Depth:
42-inch wide, extended depth cabinet

Containment:
rack-level enclosure with integrated air handling

Monitoring:
telemetry/DCIM integration

Power:
optional internal power pass-through

Safety:
built-in fire protection features; water ingress mitigation

Use Cases

Training clusters with NVL-class systems

Hyperscaler AI/HPC deployments at maximum rack width

Dense inference or mixed workloads requiring flexible cooling modalities

Deployment Scenarios

Greenfield builds maximizing aisle
density with latest GPU equipment

Targeted retrofits where wider
OCP racks are required

FAQ Decoration

FAQs

What makes S-5 GPU-ready?

Width/depth for OCP racks plus integrated liquid-to-chip pathways.

Can S-5 mix air-side and liquid cooling?

Yes. Air-side for support racks; liquid-to-chip for compute.

Does S-5 require overhead water above compute?

No. Cooling pathways are integrated within the enclosure and plumbing architecture.

Is internal power pass-through required?

Optional, based on operational preferences.

What air-side density is supported?

Up to 100 kW per rack depending on configuration.