Challenge
Hudson Interxchange (HudsonIX) will need to rapidly expand its data center capacity to support emerging AI workloads, including inference and agentic AI, within its historic 60 Hudson Street facility in New York City.
The challenge: enable ultra-high-density GPU deployments without major retrofits or disruption to legacy infrastructure.
Solution
HudsonIX partnered with DDC Solutions to deploy the modular S-Series platform. This cabinet-based cooling solution will provide:
- Scalable to support ultra-high density cooling
- Hybrid air + liquid-to-chip cooling integration
- Modular, rack-ready deployment with minimal site modification
- Scalable design to support diverse tenant power requirements
Results
- GPU-ready data center space in one of NYC’s most connected facilities
- First tenant (Cato Digital) supporting inference and agentic AI workloads
- Future-proofed infrastructure that enables high-density colocation offerings
- Ability to command premium rates without sacrificing legacy integrity
Customer Quote
“As our customers’ computing needs evolve, they demand greater flexibility across a wide range of power densities. The modular design of the DDC cooling platform allows us to seamlessly support any density, at any scale. No other facility in the New York area can match the combination of power capacity, space, and rack-ready high-density solutions that we are now positioned to offer.”
— Atul Roy, Chief Executive Officer, Hudson Interxchange
