BUILD an environment THAT CAN HANDLE ANYTHING

EFFICIENTLY RUN GPU-LADEN HPC ENVIRONMENTS WITH ULTRA-HIGH-DENSITY COOLING.

• Liquid thermal management - Chilled water supports thermal cooling coils and liquid-to-chip cooling to reduce heat for GPU-laden environments.
• Velocity augmentation – High-velocity fans push chilled air throughout the cabinet at up to 10,000 CFM while a separate fan draws the hot air out of the cabinet for optimal cooling. 

PUSH BEYOND THE LIMITS OF EXISTING DATA CENTER CAPABILITIES TO BUILD THE FUTURE OF AI.

• Consistent environmental control - With less than 2° temperature variation from top to bottom of the cabinet, DDC delivers consistent air supply and temperature management to even the most high-density and ever-changing AI workloads.
• Dynamic density management – Each DDC cabinet dynamically adjusts cooling to meet AI demands. As workloads transform, dynamically move from 1kW to 100kW using air cooling. Direct liquid-to-chip capabilities can accommodate up to 400kW per cabinet, ensuring your business is future-proofed.

EACH SELF-CONTAINED CABINET CREATES AN ENCLOSED, CLEAN-ROOM-LIKE ENVIRONMENT, EXTENDING THE LIFE OF YOUR VALUABLE IT EQUIPMENT.

• Noise reduction and  heat transfer - Enclosures with recirculated, filtered air, eliminates heat and noise transfer into the surrounding space while keeping hardware in optimal condition. 
• Deploy equipment quickly - With the ability to use nearly any water source, deploy enterprise-class, ultra-high-density data center cooling in a variety of locations, in weeks instead of months.